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Axel Boström, Franz Wotawa
Abstract: As the automotive industry increasingly relies on wireless technologies, a new attack surface emerges, pos- ing significant security threats to modern cars. This paper investigates the vulnerabilities and risks of wireless vehicle attacks, including eavesdropping, message tampering, spoof- ing, and jamming. It highlights vulnerabilities in the CAN bus communication interface. By exploring these attacks and their potential consequences, this paper aims to shed light on the urgent need for robust security measures to safeguard the safety and privacy of vehicle owners. The focus is on under- standing the evolving landscape of wireless threats in the au- tomotive industry, providing valuable insights for researchers, practitioners, and stakeholders involved in developing effective countermeasures and enhancing overall vehicle security. In contrast to other research articles, this paper presents the ISO/SAE DIS 21434 standard, which offers a systematic and structured approach to enhance cybersecurity in the automotive industry, even in the face of emerging wireless threats. In addition, this paper highlights notable examples of attacks on modern cars, where researchers gained access to vehicle systems through wireless vulnerabilities, demonstrating the potential dangers of interconnected car systems to illustrate the real-world implications.
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M. van Soestbergen; R. Roucou; M. Rebosolan; J.J. M Zaal
Abstract: To ensure sufficient field life of solder joints, standardized stress tests are performed during the development phase of products, where calibrated thermo-mechanical simulations are frequently used to ensure a potentially sufficient robustness margin. In this work we show how simulations are calibrated for the QFN (Quad Flat No leads) package family. Using thorough failure analysis, we found that for QFN packages two types of solder joint failure modes can occur. The first failure mode is a brittle fracture through the intermetallic region near the solder interface, the other mode is a crack through the bulk of the solder. In the simulations we handle both failure modes using two different failure metrics. For the brittle fractures we analyzed the volumetric strain energy density in a thin region near the interface. For bulk fails we computed the volume-averaged inelastic strain energy density across the whole solder joint. Using both metrics we found a correlation between simulation and experimental results, where Miner’s rule was used to correlate the results of any non-functional anchor joint to the experimental results of the functional joints. The correlation can be used to predict the solder performance upfront in the design phase, and thus reduce the experimental effort during product development.
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Lucas Sommeregger, Horst Lewitschnig
Abstract: In automotive industry, quality and safety are of high importance. Especially with the upcoming development of autonomous vehicles, the topics of predictive health management and estimation of residual useful life have become topics of interest. Semiconductor manufacturers in this area have to guarantee a high standard of quality in shipped devices over their whole lifetime. Electrical parameters of these devices are specified in data sheets and have to be kept within specified limits over the devices’ expected usage time. To simulate the real lifetime, accelerated stress tests are performed on a random sample of parts. During these tests, electrical parameters may drift over time. This is called lifetime drift. To control for lifetime drift, tighter test limits are introduced at production testing. The goal of these limits is to guarantee quality levels in shipped devices while maximizing manufacturers’ yields. The areas between specified limits and test limits are called guard bands. Statistical models for drift calculation and guard banding parameter drift can be used to identify parameters indicating gradual degradation processes and to estimate the expected remaining useful life of the device. Random samples are put to environmental stress tests. In this way, longitudinal data are generated. Several lifetime drift models for continuous parameters have been developed in the past [1], [2]. However, for discrete parameters (logic vectors, bit-flips, counts etc.) these models are not universally applicable. Furthermore, existing models are currently too computationally expensive to monitor parameters in real time in self-driving vehicles. We propose a semiparametric and distribution-free mixed Markov transition model for discrete parameters based on interval estimation of transition probabilities from sparse data. Drift group formation is considered via clustering and mixture modelling. The method assumes homogenous behavior in the distribution of differences between successive readout points and can be extended to cover several types of interpolating behaviours. The guard banding algorithm is performed using efficient matrix multiplication with intelligent warm starts for the two-dimensional integer optimization problem. For the calculation of residual useful life, we propose one model based on interval estimations from quantile regression on the whole sample and further show how to extend the transition Markov chain model into unobserved time periods. The results are verified via simulation studies and compared to adapted state-of-the-art models for continuous parameters. The work has been performed in the project ArchitectECA2030 under grant agreement No 877539. The project is co- funded by grants from Germany, Netherlands, Czech Republic, Austria, Norway and - Electronic Component Systems for European Leadership Joint Undertaking (ECSEL JU). All ArchitectECA2030 related communication reflects only the author’s view and ECSEL JU and the Commission are not responsible for any use that may be made of the information it contains.
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Nicolas Gerlin, Endri Kaja, Fabian Vargas, Li Lu, Anselm Breitenreiter, Junchao Chen, Markus Ulbricht, Maribel Gomez, Ares Tahiraga, Sebastian Prebeck, Eyck Jentzsch, Milos Krstic, Wolfgang Ecker
Abstract: Electronic systems can be submitted to hostile environments leading to bit-flips or stuck-at faults and, ultimately, a system malfunction or failure. In safety-critical applications, the risks of such events should be managed to prevent injuries or material damage. This paper provides a comprehensive overview of the challenges associated with designing and verifying safe and reliable systems, as well as the potential of the RISC-V architecture in addressing these challenges.We present several state-of-the-art safety and reliability verification techniques in the design phase. These include a highly-automated verification flow, an automated fault injection and analysis tool, and an AI-based fault verification flow. Furthermore, we discuss core hardening and fault mitigation strategies at the design level. We focus on automated SoC hardening using model-driven development and resilient processing based on sensing and prediction for space and avionic applications.By combining these techniques with the inherent flexibility of the RISC-V architecture, designers can develop tailored solutions that balance cost, performance, and fault tolerance to meet the requirements of various safety-critical applications in different safety domains, such as avionics, automotive, and space. The insights and methodologies presented in this paper contribute to the ongoing efforts to improve the dependability of computing systems in safety-critical environments.
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Adwait Inamdar, Michiel van Soestbergen, Amar Mavinkurve, Willem van Diel, GuoQi Zhang
Abstract: Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical, electrical, and chemical behaviour. High-temperature ageing of electronic packages causes the oxidation of epoxy moulding compounds (EMC), forming a layer exhibiting significantly different thermomechanical properties. This reflects in the modified mechanical behaviour of the entire package, which accelerates certain failure modes and affects component reliability. Thus, it is crucial to consider gradual degenerative changes in EMC for a more accurate estimation of the component lifetime. This paper proposes a three-step modelling approach to replicate thermo-chemical changes in package encapsulation. A parametric geometry of a test package was incorporated with the ageing stage-dependent changes in thermomechanical properties of the oxidized layer. The mechanical behaviour of oxidized EMC at multiple stages of thermal ageing (at 150°C for up to 3000 hours) was first experimentally characterized and then validated using warpage measurements on thermally aged test packages and Finite Element (FE) simulations. Lastly, a trend-based interpolation of material model parameters for intermediate stages of ageing was followed, and a continuously updated degradation model (physics-based Digital Twin) was achieved. The proposed model is capable of reproducing degraded stages of the test package under thermal ageing along with its modified thermomechanical behaviour. Its limitations and significance in the domain of health monitoring of microelectronics are also discussed.
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