TUDELFT will develop a novel digital twinning methodology which will be demonstrated in collaboration with the industrial partners
Delft University of Technology is one of the world-wide leading universities focusing on fundamental and applied R&D to address various key society needs. TUDelft provides top education and research situated at the heart of the oldest and largest technical university in the Netherlands. Our 8 faculties offer 16 bachelor's and more than 30 master's programs. Our more than 25,000 students and 6,000 employees share a fascination for science, design and technology. Our common mission: impact for a better society.
The Else Kooi Laboratory (EKL, formerly Dimes) is one of the top institutes focusing on “More than Moore” technologies, with more than 250 PhD and Postdoc researchers. EKL has been collaborating for many years with several industrial partners (i.e. NXP, Boschman, Besi, Philips, Signify, ams, Ampleon, Nexperia, FEI, ASML, etc.) to study, investigate and develop new materials and process technologies. These materials and process technologies have often been successfully transferred to companies and further developed into commercial products.
As part of EKL, the involved research group has 5 postdocs, 28 PhD researchers and 6 permanent staff, all working on various scientific challenges related to “Heterogeneous System Integration and Reliability”. The group plays active roles in the definition and execution of major EU funded research programs, such as SEEL, E-SiP, CSSL, Enlight, IoSense, COSMODU, Power2Power, and relevant NL national R&D programs, such as NWO-TTW, M2I, Point-One and NanoNextNL.
TU Delft is in the unique position to lead future development of heterogeneous system integration, mainly due to its first-class cleanroom facilities, leading expertise and strong industrial partnership, covering the entire product chain from novel functional materials, silicon and SiC dies, multi-functional sensors, packaging, to multi-functional modules. We have system integration expertise on 3 levels, namely: wafer, packaging and assembly, supported by leading multi-scale and multi-physical simulation, optimization and design knowledge. With our combined process and research facilities we can realize rapid process and product development. Multi-scale and multi-physics simulation and optimization, and design for reliability are our other key competencies. Combined with a fundamental understanding of systems and materials we are able to develop competitive solutions for heterogeneous system integration and reliability.
TU Delft key contributions are:
• Development of data-driven and physics of failure models which will be combined to enable digital twinning, which can be used by industrial partners for lifetime monitoring and design for reliability
• Investigation of the use of the digital twin for reliability prediction during the usage phase of the system
• Dissemination via courses, international conferences, special training, and publications
